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    3D stacking using Cu-Cu direct bonding

    Hu, Yu-Hsiang
    ;
    Liu, C.S.
    ;
    Lii, M.J.
    ;
    Rebibis, Kenneth June  
    ;
    Jourdain, Anne  
    ;
    La Manna, Antonio  
    Proceedings paper
    2012-02, IEEE International 3D System Integration Conference - 3DIC, 31/01/2012, p.1-Mar

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