Browsing by Author "Zang, S."
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Publication Electroless nickel-gold stud bumping on laminate for flip-chip assembly
;Zang, S. ;Vereecken, M. ;De Baets, J.; ;Vervaet, A. ;Peeters, JorisAllaert, K.Oral presentation1997, Printed Circuit Board Technology; January 1997; Berlin, Germany.