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Browsing by Author "Zang, S."

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    Electroless nickel-gold stud bumping on laminate for flip-chip assembly

    Zang, S.
    ;
    Vereecken, M.
    ;
    De Baets, J.
    ;
    Van Calster, Andre  
    ;
    Vervaet, A.
    ;
    Peeters, Joris
    ;
    Allaert, K.
    Oral presentation
    1997, Printed Circuit Board Technology; January 1997; Berlin, Germany.

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