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Browsing by Author "Zhang, G.Q."

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    Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assemblies

    Vandevelde, Bart  
    ;
    Gonzalez, Mario  
    ;
    Beyne, Eric  
    ;
    Zhang, G.Q.
    ;
    Caers, J.
    Proceedings paper
    2003, Proceedings of the 53rd Electronic Components and Technology Conference, 27/05/2003, p.589-596

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