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Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assemblies
Publication:
Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assemblies
Date
2003
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Gonzalez, Mario
;
Beyne, Eric
;
Zhang, G.Q.
;
Caers, J.
Journal
Abstract
Description
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1890
since deposited on 2021-10-15
428
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1890
since deposited on 2021-10-15
428
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations