Browsing by Author "Zhang, K.G.Q."
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Publication Parameterised modelling of thermo-mechanical reliability for CSP assemblies
Journal article2003, ASME Journal of Electronic Packaging, (125) 4, p.498-805Publication Solder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method
Journal article2002, IEEE Trans. Electronics Packaging Manufacturing, (25) 4, p.318-325