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Parameterised modelling of thermo-mechanical reliability for CSP assemblies
Publication:
Parameterised modelling of thermo-mechanical reliability for CSP assemblies
Date
2003
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Beyne, Eric
;
Zhang, K.G.Q.
;
Caers, J.
;
Vandepitte, D.
;
Baelmans, M.
Journal
ASME Journal of Electronic Packaging
Abstract
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1941
since deposited on 2021-10-15
427
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1941
since deposited on 2021-10-15
427
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations