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Browsing by Author "Zinner, Dominik"

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    Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology

    Peng, Lan  
    ;
    Kim, Soon-Wook  
    ;
    Iacovo, Serena  
    ;
    Inoue, Fumihiro  
    ;
    Phommahaxay, Alain  
    ;
    Sleeckx, Erik  
    Proceedings paper
    2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.985-992

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