Browsing by Author "de Vos, Joeri"
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Publication 3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
; ; ; ; ;de Vos, JoeriProceedings paper2020, 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), JUL 21-23, 2020, p.219-228