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Browsing by Author "de Vos, Joeri"

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    3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding

    Oprins, Herman  
    ;
    Cherman, Vladimir  
    ;
    Webers, Tomas  
    ;
    Kim, Soon-Wook  
    ;
    de Vos, Joeri
    ;
    Van der Plas, Geert  
    Proceedings paper
    2020, 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), JUL 21-23, 2020, p.219-228

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