Publication:
3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
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1904 since deposited on 2021-11-02
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Acq. date: 2026-04-26
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Statistics
Views
1904 since deposited on 2021-11-02
1last month
1last week
Acq. date: 2026-04-26
Citations