Publication:
3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
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1901 since deposited on 2021-11-02
Acq. date: 2025-10-27
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Views
1901 since deposited on 2021-11-02
Acq. date: 2025-10-27
Citations