Browsing by Author "van Veen, Co"
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Publication Finite element analysis of ultra thin BGA package: first and second level reliability
Proceedings paper2004-05, EuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, 9/05/2004, p.225-232Publication Influence of solder joint shape on the thermo-mechanical reliability of CSP's
Journal article2004, Journal of Microelectronics and Electronic Packaging, (1) 2, p.53-63