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Finite element analysis of ultra thin BGA package: first and second level reliability
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Finite element analysis of ultra thin BGA package: first and second level reliability
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Date
2004-05
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Limaye, Paresh
;
Vandevelde, Bart
;
de Vries, Hans
;
Degryse, Dominiek
;
Slob, Kees
;
van Veen, Co
;
Labie, Riet
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1947
since deposited on 2021-10-15
2
last month
Acq. date: 2025-12-10
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Metrics
Views
1947
since deposited on 2021-10-15
2
last month
Acq. date: 2025-12-10
Citations