Publication:
Finite element analysis of ultra thin BGA package: first and second level reliability
Date
| dc.contributor.author | Limaye, Paresh | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | de Vries, Hans | |
| dc.contributor.author | Degryse, Dominiek | |
| dc.contributor.author | Slob, Kees | |
| dc.contributor.author | van Veen, Co | |
| dc.contributor.author | Labie, Riet | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Labie, Riet | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
| dc.date.accessioned | 2021-10-15T14:28:12Z | |
| dc.date.available | 2021-10-15T14:28:12Z | |
| dc.date.issued | 2004-05 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9204 | |
| dc.source.beginpage | 225 | |
| dc.source.conference | EuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems | |
| dc.source.conferencedate | 9/05/2004 | |
| dc.source.conferencelocation | Brussel Belgium | |
| dc.source.endpage | 232 | |
| dc.title | Finite element analysis of ultra thin BGA package: first and second level reliability | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |