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Browsing by Author "van der Waal, Adri"

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    Residual stress in silicon caused by Cu-Sn wafer-level packaging

    Taklo, Maaike
    ;
    Vardĝy, Astrid-Sofie
    ;
    De Wolf, Ingrid  
    ;
    Simons, Veerle  
    ;
    van de Wiel, H.J.
    Meeting abstract
    2013, International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK, 16/07/2013, p.73317

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