Browsing by author "Lantasov, Yuri"
Now showing items 1-8 of 8
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Direct copper electroplating
Lantasov, Yuri; Palmans, Roger; Maex, Karen (2000) -
Integration of electroless and electrolytic Cu and IC back end of line technologies
Maex, Karen; Brongersma, Sywert; Lantasov, Yuri; Richard, Emmanuel; Palmans, Roger; Vervoort, Iwan (2000) -
Integration of electroless and electrolytic Cu in the IC back end line of technologies
Maex, Karen; Palmans, Roger; Lantasov, Yuri; Brongersma, Sywert; Richard, Emmanuel; Vervoort, Iwan (1999) -
Investigation on the corrosion of Cu metallization in the focused ion beam system due to a low I2 background
Bender, Hugo; Jin, S.; Vervoort, Iwan; Lantasov, Yuri (1999) -
New plating bath for electroless copper deposition on sputtered barrier layers
Lantasov, Yuri; Palmans, Roger; Maex, Karen (2000) -
New plating path for electroless copper deposition on sputtered barrier layers
Lantasov, Yuri; Min, Woo Sig; Palmans, Roger; Maex, Karen (1999) -
The formation of Pd seeded copper layer on TiN substrates by electroless deposition
Min, Woo Sig; Lantasov, Yuri; Palmans, Roger; Maex, Karen; Lee, D. N. (1998) -
The formation of Pd seeded copper layer on TiN substrates by electroless deposition
Min, Woo Sig; Lantasov, Yuri; Palmans, Roger; Maex, Karen; Dong, Nyung Lee (1999)