Browsing by author "Allaert, K."
Now showing items 1-19 of 19
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A new cost-effective TAB technology for small and medium volumes
Dravet, A.; Sechez, S.; Van Calster, Andre; De Baets, J.; Venfleteren, J.; Allaert, K.; Vetter, P.; Forrest, M.; Schols, G.; Deckelmann, K.; Wiese, J.; Cortes, E. (1995) -
Characterization of integrated resistors for broadband telecom printed circuit boards
Peeters, Joris; Ackaert, Ann; Vandamme, Lorenz; Allaert, K.; Botte, Marnix; Van Den Torren, Luc; Martens, Luc; De Zutter, Daniel (1996) -
Electroless nickel-gold stud bumping on laminate for flip-chip assembly
Zang, S.; Vereecken, M.; De Baets, J.; Van Calster, Andre; Vervaet, A.; Peeters, Joris; Allaert, K. (1997) -
Experimental thermal characterisation of electronic components by means of the submerged double jet impingement (SDJI) method
Christiaens, Filip; Beyne, Eric; Vandevelde, Bart; Roggen, Jean; Mertens, Robert; Temmerman, W.; Nelemans, W.; Lauwers, E.; Allaert, K. (1997) -
Experimental thermal characterisation of electronic packages in a fluid bath environment
Christiaens, Filip; Beyne, Eric; Temmerman, W.; Allaert, K.; Nelemans, W. (1997) -
Flip-chip assembly for chips with gold bumps on high density thic film substrates
Vrana, M.; Van Calster, Andre; Van den Berghe, R.; Allaert, K. (1997) -
Interconnection technology for advanced high density thick films
Vrana, M.; Van Calster, Andre; Vanden Berghe, R.; Allaert, K. (1995) -
Mixed assembly of PCB using a novel flip-chip technology
Vanfleteren, Jan; Stoukatch, Serguei; Vandecasteele, Bjorn; Van Calster, Andre; Criel, Steven; Willems, Geert; De Langhe, Pascal; Vandamme, Lorenz; Allaert, K. (2000) -
Mixed assembly on PCB using a novel flip-chip technology
Vanfleteren, Jan; Stoukatch, Serguei; Vandecasteele, Bjorn; Van Calster, Andre; Criel, Steven; Willems, Geert; De Langhe, Pascal; Vandam, L.; Allaert, K. (2000) -
Multifibre Electro-Optical Modules Compatible with the Fibre in Board Technology
De Pestel, Geert; Delbare, W.; Allaert, K.; Ambrosy, A.; Tan, Qingsheng; Vandewege, Jan; Verbeke, Jan; Vrana, M. (1994) -
Photo-imageable thick films for multichip modules
Vrana, M.; Van Calster, Andre; Vanicky, D.; Delbare, W.; Vanden Berghe, R.; Demolder, S.; Allaert, K. (1995) -
Photoimaginable thick films for multi chip modules
Vrana, M.; Van Calster, Andre; Vanicky, D.; Delbare, W.; Vanden Berghe, R.; Demolder, S.; Allaert, K. (1994) -
Photovia technology: some important aspects for reliability
Zhang, S.; De Baets, J.; Van Calster, Andre; Corlatan, D.; De Langhe, Pascal; Allaert, K. (1999) -
Radiated emission of PCB tracks
De Langhe, Pascal; Olyslager, Frank; Franchois, Ann; De Zutter, Daniel; Allaert, K. (1996) -
Samenwerking Industrie-Universiteit Helpt de EMC-Materie te Ontmaskeren
Allaert, K.; Cumps, M.; De Langhe, Pascal; De Smedt, R.; Franchois, Ann; De Zutter, Daniel; Martens, Luc; Olyslager, Frank (1995) -
The realisation of photo-via technology using multiposit as a photo imageable dielectric
Zhang, S.; Vereeken, Maria; De Baets, J.; Van Calster, Andre; Peeters, Joris; Allaert, K. (1998) -
The use of integrated resistors and buried capacitance in high performance telecom printed circuit boards
Peeters, Joris; Roose, Erik; Vandamme, Lorenz; Ackaert, Ann; Allaert, K.; Van Den Torren, Luc; Martens, Luc (1996) -
Thermo-mechanical analysis of flip chip on substrate bumps - assemblies
Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Roggen, Jean; Peeters, J.; Allaert, K. (1997) -
Thermomechanical models for leadless solder interconnections in flip chip assemblies
Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Roggen, Jean; Peeters, J.; Allaert, K.; Vandepitte, D.; Bergmans, J. (1998)