Browsing by author "Van Hoovels, Nele"
Now showing items 1-6 of 6
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A calibrated pathfinding model for signal integrity analysis on interposer
Kim, Jaemin; Kim, Sunyoung; Ryckaert, Julien; Detalle, Mikael; Van Hoovels, Nele; Marchal, Pol (2012) -
A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding
Bogaerts, Lieve; Phommahaxay, Alain; Rottenberg, Xavier; Naito, Yasyuki; De Coster, Jeroen; Varela Pedreira, Olalla; Van Hoovels, Nele; Cherman, Vladimir; Helin, Philippe; Onishi, K.; Tilmans, Harrie (2011) -
Compact tunable YIG-based RF resonators
Costa, Diogo; Figeys, Bruno; Sun, Xiao; Van Hoovels, Nele; Tilmans, Harrie; Ciubotaru, Florin; Adelmann, Christoph (2021) -
Comparison of silicon ring modulators with interdigitated and lateral PN junctions
Pantouvaki, Marianna; Yu, Hui; Rakowski, Michal; Christie, Phillip; Verheyen, Peter; Lepage, Guy; Van Hoovels, Nele; Absil, Philippe; Van Campenhout, Joris (2013) -
Copper oxide direct bonding of 200 mm CMOS wafers with five metal levels and TSVs: morphological and electrical characterization
Cavaco, Celso; Peng, Lan; Lavizzari, Simone; Claes, Jesse; Van Hoovels, Nele; Guerrieri, Stefano; Sabuncuoglu Tezcan, Deniz; Osman, Haris (2016) -
Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding
Pham, Nga; Cherman, Vladimir; Vandevelde, Bart; Limaye, Paresh; Tutunjyan, Nina; Jansen, Roelof; Van Hoovels, Nele; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Beyne, Eric; Tilmans, Harrie (2011)