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Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding
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Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding
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Date
2011
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Pham, Nga
;
Cherman, Vladimir
;
Vandevelde, Bart
;
Limaye, Paresh
;
Tutunjyan, Nina
;
Jansen, Roelof
;
Van Hoovels, Nele
;
Sabuncuoglu Tezcan, Deniz
;
Soussan, Philippe
;
Beyne, Eric
;
Tilmans, Harrie
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1995
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Views
1995
since deposited on 2021-10-19
1
last month
1
last week
Acq. date: 2026-02-24
Citations