Browsing by author "Strubbe, Katrien"
Now showing items 1-20 of 21
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Adsorption/desorption of suppressor complex on copper: description of the critical potential
Atanasova, Tanya; Strubbe, Katrien; Vereecken, Philippe (2010) -
Adsorption/desorption of suppressor complex on copper: description of the critical potential
Atanasova, Tanya; Strubbe, Katrien; Vereecken, Philippe (2011-01) -
Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Radisic, Alex; Nagar, Magi; Strubbe, Katrien; Armini, Silvia; El-Mekki, Zaid; Volders, Henny; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Direct copper plating on a RuTa substrate
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2010) -
Effect of ionic strength and the electrolyte composition on the suppression of copper deposition by PEG
Atanasova, Tanya; Strubbe, Katrien; Vereecken, Philippe (2010) -
Electrochemical determination of the cupric ion activity in aqueous acidic cupric sulfate electrolytes
Atanasova, Tanya; Strubbe, Katrien; Vereecken, Philippe (2013) -
Exploration of process window for fill of sub 30 nm features by direct plating
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2012) -
Nanoscale etching: dissolution of III-As and Ge in HCl/H2O2 solutions
van Dorp, Dennis; Weinberger, David; Van wonterghem, S.; Arnauts, Sophia; Strubbe, Katrien; Holsteyns, Frank; De Gendt, Stefan (2015-10) -
Nucleation and growth of copper on Ru-based substrates: I. the effect of the inorganic components
Nagar, Magi; Vereecken, Philippe; Strubbe, Katrien; Radisic, Alex (2011) -
Nucleation and growth of copper on Ru-Based Substrates: I. The effect of the inorganic components
Nagar, Magi; Vereecken, Philippe; Strubbe, Katrien; Radisic, Alex (2012) -
Nucleation and growth of copper on Ru-based substrates: II. the effect of the suppressor additive
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2011) -
Nucleation and growth of copper on Ru-based substrates: II. The effect of the suppressor additive
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2012) -
Physicochemical mechanism of damascene copper plating: effect of suppressor
Atanasova, Tanya; Strubbe, Katrien; Vereecken, Philippe (2009) -
Polyether suppressors for filling sub 30 nm features by direct plating
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2012) -
Tailoring copper island density for copper plating on a RuTa substrate
Nagar, Magi; Vereecken, Philippe; Radisic, Alex; Strubbe, Katrien (2010) -
The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2013) -
The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2014) -
The effect of the substrate characteristics on the electrochemical nucleation and growth of copper
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2016) -
Ultra-low copper baths for sub-30nm copper interconnects
Atanasova, Tanya; Caluwaerts, Rudy; Carbonell, Laure; Strubbe, Katrien; Vereecken, Philippe (2011) -
Ultra-low copper baths for sub-35 nm copper interconnects
Atanasova, Tanya; Carbonell, Laure; Caluwaerts, Rudy; Tokei, Zsolt; Strubbe, Katrien; Vereecken, Philippe (2013)