Now showing items 1-4 of 4

    • Extreme thinning of Si wafers for via-last and multi wafer stacking applications 

      Jourdain, Anne; De Vos, Joeri; Rassoul, Nouredine; Zahedmanesh, Houman; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Ashraf, Huma; Thomas, Dave; Li, Shifang; Chang, Timothy; Hiebert, Stephen; Cross, Andrew; Stoerring, Moritz (2018)
    • In-line metrology for characterization and control of extreme wafer thinning of bonded wafers 

      Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, G.; Stoerring, Moritz; Hiebert, S.; Cross, Andrew (2017)
    • In-line metrology for characterization and control of extreme wafer thinning of bonded wafers 

      Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, Gerard; Stoerring, Moritz; Hiebert, Stephen; Cross, Andrew (2019)
    • NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips 

      Iturbe, Xabier; Abderrahmane, Nassim; Abella, Jaume; Alcaide, Sergi; Beyne, Eric; Charles, Henri-Pierre; Charpin-Nicolle, Christelle; Chittka, Lars; Davila, Angelica; Erdmann, Arne; Estrada, Carles; Fernandez, Ander; Fontanelli, Anna; Flich, Jose; Furano, Gianluca; Gloriani, Alejandro Hernan; Isusquiza, Erik; Grosu, Radu; Hernandez, Carles; Ielmini, Daniele; Jackson, David; Kooli, Maha; Lepri, Nicola; Linares-Barranco, Bernabe; Lachese, Jean-Loup; Laurent, Eric; Lindwer, Menno; Linsenmaier, Frank; Lujan, Mikel; Masarik, Karel; Mentens, Nele; Moreira, Orlando; Nawghane, Chinmay; Peres, Luca; Noel, Jean-Philippe; Pourtaherian, Arash; Posch, Christoph; Priller, Peter; Prikryl, Zdenek; Resch, Felix; Rhodes, Oliver; Stefanov, Todor; Störring, Moritz; Taliercio, Michele; Tornero, Rafael; van de Burgwal, Marcel; van der Plas, Geert; Vianello, Elisa; Zaykov, Pavel (2023)