Browsing by author "Chen, Rongmei"
Now showing items 1-18 of 18
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3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes
Chen, Rongmei; Weckx, Pieter; Salahuddin, Shairfe Muhammad; Kim, Soon-Wook; Sisto, Giuliano; Van der Plas, Geert; Stucchi, Michele; Baert, Rogier; Debacker, Peter; Na, Myung Hee; Ryckaert, Julien; Milojevic, Dragomir; Beyne, Eric (2020) -
A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability Analysis
Xu, Baohui; Chen, Rongmei; Zhou, Jiuren; Liang, Jie (2024) -
A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure
Xu, Baohui; Chen, Rongmei; Zhou, Jiuren; Liang, Jie (2023) -
Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation--Part I: CNFET Transistor Optimization
Chen, Rongmei; Chen, Lin; Liang, Jie; Cheng, Yuanqing; Elloumi, Souhir; Lee, Jaehyun; Xu, Kangwei; Georgiev, Vihar P.; Ni, Kai; Debacker, Peter; Asenov, Asen; Todri-Sanial, Aida (2022) -
Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation--Part II: CNT Interconnect Optimization
Chen, Rongmei; Chen, Lin; Liang, Jie; Cheng, Yuanqing; Elloumi, Souhir; Lee, Jaehyun; Xu, Kangwei; Georgiev, Vihar P.; Ni, Kai; Debacker, Peter; Asenov, Asen; Todri-Sanial, Aida (2022) -
Design and Optimization of SRAM Macro and Logic Using Backside Interconnects at 2nm node
Chen, Rongmei; Sisto, Giuliano; Jourdain, Anne; Hiblot, Gaspard; Stucchi, Michele; Kakarla, Naveen; Chehab, Bilal; Salahuddin, Shairfe Muhammad; Schleicher, Filip; Veloso, Anabela; Hellings, Geert; Weckx, Pieter; Milojevic, Dragomir; Van der Plas, Geert; Ryckaert, Julien; Beyne, Eric (2021) -
Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)
Sisto, Giuliano; Chen, Rongmei; Chou, Richard; Van der Plas, Geert; Beyne, Eric; Rod Metcalfe; Milojevic, Dragomir (2021-11-04) -
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs
Naeim, Mohamed; Yang, Hanqi; Chen, Pinhong; Bao, Rong; Dekeyser, Antoine; Sisto, Giuliano; Brunion, Moritz; Chen, Rongmei; Van der Plas, Geert; Beyne, Eric; Milojevic, Dragomir (2023) -
Extended Methodology to Determine SRAM Write Margin in Resistance-Dominated Technology Node
Liu, Hsiao-Hsuan; Salahuddin, Shairfe Muhammad; Abdi, Dawit; Chen, Rongmei; Weckx, Pieter; Matagne, Philippe; Catthoor, Francky (2022) -
Heavy-ion and pulsed laser induced single-event double transients in nanometer inverter chain
Zhao, Wen; Chen, Wei; He, Chaohui; Chen, Rongmei; Zhang, Fengqi; Guo, Xiaoqiang; Lu, Chao; Shen, Chen (2023) -
Increasing Functionality of Wafer's Backside: Analysis of Si and WS2 Backside Power-Switch
Mirabelli, Gioele; Chen, Rongmei; Ahmed, Zubair; Chehab, Bilal; Zografos, Odysseas; Hiblot, Gaspard; Weckx, Pieter; Hellings, Geert; Ryckaert, Julien (2023) -
Innovations in Transistor Architecture and Device Connectivity for Advanced Logic Scaling
Veloso, Anabela; Eneman, Geert; De Keersgieter, An; Favia, Paola; Hikavyy, Andriy; Chen, Rongmei; Jourdain, Anne; Horiguchi, Naoto (2022) -
Insights into Scaled Logic Devices Connected from Both Wafer Sides
Veloso, Anabela; Eneman, Geert; Matagne, Philippe; Vermeersch, Bjorn; Jourdain, Anne; Arimura, Hiroaki; O'Sullivan, Barry; Chen, Rongmei; De Keersgieter, An; Simoen, Eddy; Radisic, Dunja; Oniki, Yusuke; Lafitte, A.; Brus, Stephan; Beyne, Eric; Dentoni Litta, Eugenio; Horiguchi, Naoto (2022) -
IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs
Genneret, B.; Chou, R.; Sisto, Giuliano; Chehab, Bilal; Baert, Rogier; Chen, Rongmei; Weckx, Pieter; Ryckaert, Julien; Van der Plas, Geert; Beyne, Eric; Milojevic, Dragomir (2021) -
Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network
Chen, Rongmei; Lofrano, Melina; Mirabelli, Gioele; Sisto, Giuliano; Yang, Simei; Jourdain, Anne; Schleicher, Filip; Veloso, Anabela; Zografos, Odysseas; Weckx, Pieter; Hiblot, Gaspard; Van der Plas, Geert; Hellings, Geert; Ryckaert, Julien; Beyne, Eric (2022) -
Pushing carbon nanotube circuits below the 10-nm node
Chen, Rongmei (2023) -
Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects
Xu, Baohui; Chen, Rongmei; Zhou, Jiuren; Liang, Jie (2022) -
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
Veloso, Anabela; Jourdain, Anne; Radisic, Dunja; Chen, Rongmei; Arutchelvan, Goutham; O'Sullivan, Barry; Arimura, Hiroaki; Stucchi, Michele; De Keersgieter, An; Hosseini, Maryam; Hopf, Toby; D'have, Koen; Wang, Shouhua; Dupuy, Emmanuel; Mannaert, Geert; Vandersmissen, Kevin; Iacovo, Serena; Marien, Philippe; Choudhury, Subhobroto; Schleicher, Filip; Sebaai, Farid; Oniki, Yusuke; Zhou, X.; Gupta, Anshul; Schram, Tom; Briggs, Basoene; Lorant, Christophe; Rosseel, Erik; Hikavyy, Andriy; Loo, Roger; Geypen, Jef; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Soulie, Jean-Philippe; Devriendt, Katia; Chan, BT; Demuynck, Steven; Hiblot, Gaspard; Van der Plas, Geert; Ryckaert, Julien; Beyer, Gerald; Dentoni Litta, Eugenio; Beyne, Eric; Horiguchi, Naoto (2022)