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Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network
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Authors
Chen, Rongmei
;
Lofrano, Melina
;
Mirabelli, Gioele
;
Sisto, Giuliano
;
Yang, Simei
;
Jourdain, Anne
;
Schleicher, Filip
;
Veloso, Anabela
;
Zografos, Odysseas
;
Weckx, Pieter
;
Hiblot, Gaspard
;
Van der Plas, Geert
;
Hellings, Geert
;
Ryckaert, Julien
;
Beyne, Eric
DOI
10.1109/IEDM45625.2022.10019349
EISBN
978-1-6654-8959-1
ISSN
2380-9248
Conference
International Electron Devices Meeting (IEDM)
Journal
na
Title
Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network
Publication type
Proceedings paper
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Date
Summary
2
20.500.12860/41618.2
*
2023-06-01T15:31:15Z
validation by library/open access desk
1
20.500.12860/41618
2023-05-25T20:20:00Z
*Selected version
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