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Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)
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Authors
Sisto, Giuliano
;
Chen, Rongmei
;
Chou, Richard
;
Van der Plas, Geert
;
Beyne, Eric
;
Rod Metcalfe
;
Milojevic, Dragomir
DOI
10.1109/SLIP52707.2021.00011
EISBN
978-1-6654-0083-1
ISSN
1544-5623
Conference
23rd ACM/IEEE International Workshop on System-Level Interconnect Pathfinding (SLIP)
Journal
na
Title
Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)
Publication type
Proceedings paper
Embargo date
9999-12-31
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Date
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3
20.500.12860/39525.3
*
2022-07-05T09:23:41Z
validation by library/open access desk
2
20.500.12860/39525.2
2022-07-04T07:08:33Z
validation by imec author
1
20.500.12860/39525
2022-03-26T02:08:17Z
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