Publication:

Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)

Date

2021-11-04

Proceedings Paper

https://doi.org/10.1109/SLIP52707.2021.00011

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Files

Published version 2.05 MB

Author(s)

Sisto, Giuliano

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Van der Plas, Geert

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Milojevic, Dragomir

Journal

na

Statistics

1683 since deposited on 2022-03-26

Acq. date: 2026-02-04