Now showing items 1-2 of 2

    • CVD based selective Co deposition on Cu and W for via pre-fill 

      Chen, Phil; Zheng, Jun-Fei; Lieten, Ruben; Frye, Asa; Baum, Thomas; O'Neill, James; van der Veen, Marleen; Murdoch, Gayle; Boemmels, Juergen; Tokei, Zsolt; Xu, Jeff; Zhu, John; Bao, Jerry; Badaroglu, Mustafa; Yeap, Geoffrey (2016)
    • PPAC scaling enablement for 5nm Mobile SoC technology 

      Baradoglu, Mustafa; Xu, Jeff; Zhu, John; Yang, Da; Bao, Jerry; Song, Seung-Chul; Feng, Peijie; Ritzenthaler, Romain; Mertens, Hans; Eneman, Geert; Horiguchi, Naoto; Smith, Jeffrey; Datta, Suman; Kohen, David; Chan, Po-Wen; Chen, Keagan; Chidambaram, PR. Chidi (2017)