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Conference contributions
CVD based selective Co deposition on Cu and W for via pre-fill
Publication:
CVD based selective Co deposition on Cu and W for via pre-fill
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Date
2016
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33686.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chen, Phil
;
Zheng, Jun-Fei
;
Lieten, Ruben
;
Frye, Asa
;
Baum, Thomas
;
O'Neill, James
;
van der Veen, Marleen
;
Murdoch, Gayle
;
Boemmels, Juergen
;
Tokei, Zsolt
;
Xu, Jeff
;
Zhu, John
;
Bao, Jerry
;
Badaroglu, Mustafa
;
Yeap, Geoffrey
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Acq. date: 2026-01-08
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Views
2072
since deposited on 2021-10-23
1
last month
Acq. date: 2026-01-08
Citations