Browsing by author "Cirigliano, Peter"
Now showing items 1-2 of 2
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A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
Op de Beeck, Maaike; Versluijs, Janko; Tokei, Zsolt; Demuynck, Steven; de Marneffe, Jean-Francois; Boullart, Werner; Vanhaelemeersch, Serge; Zhu, Helen; Cirigliano, Peter; Pavel, Elisabeth; Sadjadi, Reza; Kim, Jisoo (2007) -
Novel patterning shrink technique enabling sub-50nm trench and contact integration
Demuynck, Steven; Tokei, Zsolt; Zhao, Chao; de Marneffe, Jean-Francois; Struyf, Herbert; Boullart, Werner; Op de Beeck, Maaike; Carbonell, Laure; Heylen, Nancy; Vaes, Jan; Beyer, Gerald; Vanhaelemeersch, Serge; Zhu, Helen; Cirigliano, Peter; Kim, J. S.; Vertommen, Johan; Coenegrachts, Bart; Sadjadi, R.; Pavel, E.; Athayde, A. (2007)