Browsing by author "Shingubara, Shoso"
Now showing items 1-7 of 7
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Development of glyoxylic acid based electroless copper deposition on ruthenium
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu; Shingubara, Shoso (2014) -
Development of glyoxylic acid based electroless copper deposition on ruthenium
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Shingubara, Shoso; Tanaka, Tetsu (2015) -
Electroless copper bath stability monitoring with UV-VIS spectroscopy, pH, and mixed potential measurements
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Shingubara, Shoso; Leunissen, Peter (2012) -
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Leunissen, Peter; Kondo, Muneharu; Webb, Eric; Shingubara, Shoso (2013) -
Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Shingubara, Shoso; Tanaka, Tetsu (2015) -
Low temperature through-Si via fabrication using electroless deposition
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Leunissen, Peter; Miyake, Hiroshi; Arima, Ryohei; Shimizu, Tomohiro; Ito, Toshiaki; Seki, Hirofumi; Shinozaki, Yuko; Yamamoto, Tomohiko; Shingubara, Shoso (2012) -
Novel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSV
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Leunissen, Peter; Shingubara, Shoso (2012)