Browsing by author "Reybrouck, Mario"
Now showing items 1-6 of 6
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Back-end, low-k dielectric compatible resist rework procedure
Reybrouck, Mario; Vangoidsenhoven, Diziana; Maenhoudt, Mireille; Van Aelst, Joke; Boullart, Werner (2002) -
Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm node
Bekaert, Joost; Van Look, Lieve; Truffert, Vincent; Lazzarino, Frederic; Vandenberghe, Geert; Reybrouck, Mario; Tarutani, Shinji (2010-12) -
Contact layer printing at 0.28k1 by means of double line exposure and negative tone development
Bekaert, Joost; Maenhoudt, Mireille; Vandenberghe, Geert; Reybrouck, Mario (2008) -
Intra-wafer CD-control in state-of-the-art lithography
Pollentier, Ivan; Baerts, Christina; Marschner, Thomas; Ronse, Kurt; Grozev, Grozdan; Reybrouck, Mario (1999) -
Printing the contact and metal layers for the 32 and 22 nm node: comparing positive and negative development process
Bekaert, Joost; Van Look, Lieve; Wiaux, Vincent; Truffert, Vincent; Maenhoudt, Mireille; Vandenberghe, Geert; Reybrouck, Mario; Tarutani, S. (2009) -
Resist reflow for 193-nm low-K1 lithography contacts
Montgomery, P.K.; Lucas, K.; Strozewski, K.J.; Zavyalova, L.; Grozev, Grozdan; Reybrouck, Mario; Tzviatkov, P.; Maenhoudt, Mireille (2003)