Browsing by author "Ansell, Oliver"
Now showing items 1-4 of 4
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Comparison between wet and dry silicon via reveal in 3D backside processing
Thomas, Dave; Hopkins, Janet; Ashraf, Huma; Patel, Jash; Ansell, Oliver; Jourdain, Anne; De Vos, Joeri; Miller, Andy; Beyne, Eric (2015) -
Etch process modules development and integration in 3D SOC applications
Tutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric; Miller, Andy; Piumi, Daniele; Walsby, Edward; Ansell, Oliver; Ashraf, Huma; Thomas, Dave (2017) -
Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Jourdain, Anne; De Vos, Joeri; Rassoul, Nouredine; Zahedmanesh, Houman; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Ashraf, Huma; Thomas, Dave; Li, Shifang; Chang, Timothy; Hiebert, Stephen; Cross, Andrew; Stoerring, Moritz (2018) -
Extreme wafer thinning optimization for via-last applications
Jourdain, Anne; De Vos, Joeri; Inoue, Fumihiro; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Hopkins, Janet; Ashraf, Huma; Thomas, Dave (2016)