Extreme wafer thinning optimization for via-last applications

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Authors
Jourdain, Anne; De Vos, Joeri; Inoue, Fumihiro; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Hopkins, Janet; Ashraf, Huma; Thomas, Dave
Conference
IEEE International Conference on 3D System Integration - 3DIC
Title
Extreme wafer thinning optimization for via-last applications
Publication type
Proceedings paper
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