Browsing by author "Ai, Hua"

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CVD Mn-based self-formed barrier for advanced interconnect technology

Siew, Yong Kong; Jourdan, Nicolas; Barbarin, Yohan; Machillot, Jerome; Demuynck, Steven; Croes, Kristof; Tseng, J.; Ai, Hua; Tang, Jing; Naik, M.; Wang, P.; Narasimhan, M.; Abraham, M.; Cockburn, Andrew; Boemmels, Juergen; Tokei, Zsolt (2013)
CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies

Jourdan, Nicolas; Machillot, Jerome; Barbarin, Yohan; Siew, Yong Kong; Ai, Hua; Cockburn, Andrew; Nguyen, Mai Phuong; Van Elshocht, Sven; Boemmels, Juergen; Lakshmanan, A.; Ma, Paul; Narasimhan, Murali; Tokei, Zsolt (2013)