Browsing by author "Tyrovouzi, Anna-Maria"
Now showing items 1-2 of 2
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3D IC interconnects: microbump yield electrical characterization and TSV modeling
Vakoula, Panagiota; Tyrovouzi, Anna-Maria; Velenis, Dimitrios; Stucchi, Michele; Croes, Kristof (2014) -
Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna-Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2015)