Browsing by author "Vanfleteren, Jan"
Now showing items 81-100 of 294
-
Developing an advanced module for back-contact solar cells
Govaerts, Jonathan; Robbelein, Jo; Gonzalez, Mario; Gordon, Ivan; Baert, Kris; De Wolf, Ingrid; Bossuyt, Frederick; Van Put, Steven; Vanfleteren, Jan (2011) -
Development and Washing Reliability Testing of a Stretchable Circuit on Knit Fabric
Veske, Paula; Bauwens, Pieter; Bossuyt, Frederick; Sterken, Tom; Vanfleteren, Jan (2020) -
Development of a dielectric sensor system for the on-line cure monitoring of composites
Yang, Yang; Chiesura, G.; Luyckx, G.; Vervust, Thomas; Bossuyt, Frederick; Kaufmann, M.; Degrieck, J.; Vanfleteren, Jan (2014) -
Development of a Microfluidic Chip Powered by EWOD for In Vitro Manipulation of Bovine Embryos
Karcz, Adriana; Van Soom, Ann; Smits, Katrien; Van Vlierberghe, Sandra; Verplancke, Rik; Pascottini, Osvaldo Bogado; van den Abbeel, Etienne; Vanfleteren, Jan (2023) -
Development of a Stretchable Circuit and its Integration Method on Knit Fabrics for Lower Back Injury Prevention
Veske, Paula; Bauwens, Pieter; Bossuyt, Frederick; Sterken, Tom; Schuermans, Joke; Vanfleteren, Jan (2022) -
Development of a thin-film stretchable electrical interconnection technology for biocompatible applications
Verplancke, Rik; Sterken, Tom; Axisa, Fabrice; Vanfleteren, Jan (2010) -
Draagbare elektronica met ultradunne chips en elastische circuits
Vanfleteren, Jan (2013) -
Effect of overmolding process on the integrity of electronic circuits
Bakr, Mona; Su, Yibo; Bossuyt, Frederick; Vanfleteren, Jan (2019) -
Elastic and conformable electronic circuits and assembies using MID in polymer
Axisa, Fabrice; Brosteaux, Dominique; De Leersnyder, Eva; Bossuyt, F.; Gonzalez, Mario; Vanden Bulcke, Mathieu; Vanfleteren, Jan (2007-01) -
Elastic electronic circuits and systems using moulded interconnect device (MID) technology
Vanfleteren, Jan; Axisa, Fabrice; Brosteaux, Dominique; Bossuyt, Frederick; De Leersnyder, Eva; Vervust, Thomas; Huyghe, Benoit; Missinne, Jeroen; Verplancke, Rik; Gonzalez, Mario (2008) -
Electrically-driven handling of gametes and embryos: taking a step towards the future of ARTs
Van Soom, Ann; Smits, Katrien; Verplancke, Rik; Van Vlierberghe, Sandra; Karcz, Adriana; Vanfleteren, Jan (2022) -
Electro-conductive adhesives for high density package and flip-chip interconnections
Wojciechowski, Dominique; Vanfleteren, Jan; Reese, E.; Hagedorn, H. W. (2000) -
Electroless nickel plating bath composition and replenishment for microvia plating process
Stoukatch, Serguei; Zhang, S.; Vanfleteren, Jan; Vereeken, Maria; Van Calster, Andre; Vandecasteele, Bjorn (2000) -
Embedded chips redefine miniaturization: inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multiilayer circuit boards
Parton, Els; Christiaens, Wim; Vanfleteren, Jan (2009-07) -
Embedded high resolution sensor based on optical feedback in a vertical cavity surface emitting laser
Van Hoe, Bram; Lamon, Deben; Bosman, Erwin; Van Steenberge, Geert; Missinne, Jeroen; Goethals, Pauwel; Krassimir, Panajotov; Reynaerts, Dominiek; Vanfleteren, Jan; Van Daele, Peter (2010) -
Embedded UTCP interposers for miniature smart sensors
Sterken, Tom; Op de Beeck, Maaike; Torfs, Tom; Vermeiren, Filip; Van Hoof, Chris; Vanfleteren, Jan (2012) -
Embedding and assembly of ultrathin chips in multilayer flex boards
Christiaens, Wim; Loeher, T.; Pahl, B.; Feil, M.; Vandevelde, Bart; Vanfleteren, Jan (2008) -
Embedding of active components in multilayer flex boards
Christiaens, Wim; Loeher, T.; Feil, M.; Vandevelde, Bart; Vanfleteren, Jan (2007-03) -
Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspective
Vandevelde, Bart; Brebels, Steven; Okoro, Chukwudi; Oprins, Herman; Chen, L.C.; Christiaens, W.; Vanfleteren, Jan (2007) -
Embedding of optical interconnections in flexible electronics
Bosman, Erwin; Van Steenberge, Geert; Geerinck, Peter; Christiaens, Wim; Vanfleteren, Jan; Van Daele, Peter (2007-05)