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Conference contributions
Elastic electronic circuits and systems using moulded interconnect device (MID) technology
Publication:
Elastic electronic circuits and systems using moulded interconnect device (MID) technology
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Date
2008
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19368.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vanfleteren, Jan
;
Axisa, Fabrice
;
Brosteaux, Dominique
;
Bossuyt, Frederick
;
De Leersnyder, Eva
;
Vervust, Thomas
;
Huyghe, Benoit
;
Missinne, Jeroen
;
Verplancke, Rik
;
Gonzalez, Mario
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1885
since deposited on 2021-10-17
Acq. date: 2025-12-12
Citations
Metrics
Views
1885
since deposited on 2021-10-17
Acq. date: 2025-12-12
Citations