Publication:

Elastic electronic circuits and systems using moulded interconnect device (MID) technology

Date

2008
Meeting abstract
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Author(s)

Vanfleteren, Jan  
;
Axisa, Fabrice
;
Brosteaux, Dominique
;
Bossuyt, Frederick  
;
De Leersnyder, Eva
;
Vervust, Thomas  
;
Huyghe, Benoit
;
Missinne, Jeroen  
;
Verplancke, Rik  
;
Gonzalez, Mario  

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