Publication:

Elastic electronic circuits and systems using moulded interconnect device (MID) technology

Date

2008
Meeting abstract
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dc.contributor.authorVanfleteren, Jan
dc.contributor.authorAxisa, Fabrice
dc.contributor.authorBrosteaux, Dominique
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorDe Leersnyder, Eva
dc.contributor.authorVervust, Thomas
dc.contributor.authorHuyghe, Benoit
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVerplancke, Rik
dc.contributor.authorGonzalez, Mario
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVervust, Thomas
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVerplancke, Rik
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVerplancke, Rik::0000-0002-6642-9454
dc.date.accessioned2021-10-17T12:18:42Z
dc.date.available2021-10-17T12:18:42Z
dc.date.embargo9999-12-31
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14719
dc.source.conferenceMaterials and Technology for Flexible, Conformable, and Strechtchable Sensors and Transistors
dc.source.conferencedate25/03/2008
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Elastic electronic circuits and systems using moulded interconnect device (MID) technology

dc.typeMeeting abstract
dspace.entity.typePublication
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