Browsing by author "Flack, Warren"
Now showing items 1-7 of 7
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Creating 1 $lm RDL structures for fan-out wafer-level packaging
Flack, Warren; Slabbekoorn, John (2018) -
Large area interposer lithography
Flack, Warren; Hsieh, Robert; Kenyon, Gareth; Ranjan, Manish; Slabbekoorn, John; Miller, Andy; Beyne, Eric; Toukhy, Medhat; Lu, PingHung; Yi, Cao; Chen, Chunwei (2014) -
One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material
Flack, Warren; Hsieh, Robert; Nguyen, Ha-Ai; Slabbekoorn, John; Suhard, Samuel; Miller, Andy; Hiro, Akito; Hidremont, Romain (2018) -
One micron redistribution for fan-out wafer level packaging
Flack, Warren; Hsieh, Robert; Nguyen, Ha-Ai; Slabbekoorn, John; Lorant, Christophe; Miller, Andy (2017) -
Optimization of through Si via last microlithography for 3D packaging
Slabbekoorn, John; Tobback, Bert; Vandeweyer, Tom; Miller, Andy; Flack, Warren; Hsieh, Robert; Kenyon, Gareth (2015) -
Overlay performance of through Si via last lithography for 3d packaging
Flack, Warren; Hsieh, Robert; Kenyon, Gareth; Slabbekoorn, John; Czarnecki, Piotr; Tobback, Bert; Van Huylenbroeck, Stefaan; Stucchi, Michele; Vandeweyer, Tom; Miller, Andy (2016) -
Process characterization for donut TSV's
Slabbekoorn, John; Schepers, Bart; Sardo, Stefano; Van Huylenbroeck, Stefaan; Vandeweyer, Tom; Miller, Andy; Rebibis, Kenneth June; Flack, Warren; Kenyon, Gareth; Hsieh, Robert; Ranjan, Manish (2014)