Overlay performance of through Si via last lithography for 3d packaging

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Authors
Flack, Warren; Hsieh, Robert; Kenyon, Gareth; Slabbekoorn, John; Czarnecki, Piotr; Tobback, Bert; Van Huylenbroeck, Stefaan; Stucchi, Michele; Vandeweyer, Tom; Miller, Andy
Conference
IEEE 18th Electronics Packaging Technology Conference - EPTC
Title
Overlay performance of through Si via last lithography for 3d packaging
Publication type
Proceedings paper
Embargo date
9999-12-31
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