Publication:

Overlay performance of through Si via last lithography for 3d packaging

Date

2016
Proceedings Paper
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dc.contributor.authorFlack, Warren
dc.contributor.authorHsieh, Robert
dc.contributor.authorKenyon, Gareth
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorTobback, Bert
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorStucchi, Michele
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorMiller, Andy
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorTobback, Bert
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.date.accessioned2021-10-23T10:50:33Z
dc.date.available2021-10-23T10:50:33Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26623
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7861543/
dc.source.beginpage564
dc.source.conferenceIEEE 18th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate30/11/2016
dc.source.conferencelocationSingapore Singapore
dc.source.endpage568
dc.title

Overlay performance of through Si via last lithography for 3d packaging

dc.typeProceedings paper
dspace.entity.typePublication
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