Browsing by author "Cheng, Edmund"
Now showing items 1-4 of 4
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A practical approach to thermal modeling and validation of 3D-ICs
Cupak, Miroslav; Oprins, Herman; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Srinivasan, Adi; Cheng, Edmund (2010) -
Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs
Oprins, Herman; Cherman, Vladimir; Srinivasan, Adi; Cupak, Miroslav; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Cheng, Edmund (2010-10) -
Fine grain thermal modeling of 3D stacked structures
Oprins, Herman; Cupak, Miroslav; Van der Plas, Geert; Vandevelde, Bart; Marchal, Pol; Srinivasan, Adi; Cheng, Edmund (2009-10) -
Thermal modeling and experimental validation of thermal effects of 3D-ICs
Srinivasan, Adi; Cheng, Edmund; Oprins, Herman; Van der Plas, Geert (2010)