Publication:
Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs
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1953 since deposited on 2021-10-18
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Acq. date: 2025-10-24
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Views
1953 since deposited on 2021-10-18
425item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations