Publication:
Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs
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1956 since deposited on 2021-10-18
1last month
Acq. date: 2026-04-07
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Statistics
Views
1956 since deposited on 2021-10-18
1last month
Acq. date: 2026-04-07
Citations