Authors

Oprins, Herman; Cherman, Vladimir; Srinivasan, Adi; Cupak, Miroslav; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Cheng, Edmund

Conference

16th International Workshop on Thermal investigations of ICs and Systems - Therminic

Title

Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs

Publication type

Proceedings paper