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Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs

Date

2010-10
Proceedings Paper
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dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorSrinivasan, Adi
dc.contributor.authorCupak, Miroslav
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorVandevelde, Bart
dc.contributor.authorCheng, Edmund
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned2021-10-18T19:53:21Z
dc.date.available2021-10-18T19:53:21Z
dc.date.issued2010-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17742
dc.source.conference16th International Workshop on Thermal investigations of ICs and Systems - Therminic
dc.source.conferencedate6/10/2010
dc.source.conferencelocationBarcelona Spain
dc.title

Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs

dc.typeProceedings paper
dspace.entity.typePublication
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