Publication:
Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs
Date
Loading...
Journal
Abstract
Description
Metrics
Views
1953 since deposited on 2021-10-18
Acq. date: 2025-12-11
Citations
Metrics
Views
1953 since deposited on 2021-10-18
Acq. date: 2025-12-11
Citations