Publication:
Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs
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1955 since deposited on 2021-10-18
2last month
Acq. date: 2026-02-28
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Statistics
Views
1955 since deposited on 2021-10-18
2last month
Acq. date: 2026-02-28
Citations