Browsing by author "Rodet, Simon"
Now showing items 1-8 of 8
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Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter (2011) -
Electrodeposition for 3D integration
Philipsen, Harold; Radisic, Alex; Luhn, Ole; Civale, Yann; Vandersmissen, Kevin; Rodet, Simon; Honore, Mia; Leunissen, Peter (2010) -
Front side metallization of silicon solar cells by Copper-platingaP
Hernandez, Jose Luis; Aleman, Monica; Allebe, Christophe; Bearda, Twan; John, Joachim; Kuzma Filipek, Izabela; Philipsen, Harold; Posthuma, Niels; Prajapati, Victor; Rodet, Simon; Poortmans, Jef (2010-04) -
Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Redolfi, Augusto; Velenis, Dimitrios; Thangaraju, Sarasvathi; Nolmans, Philip; Jaenen, Patrick; Kostermans, Maarten; Baier, Ulrich; Van Besien, Els; Dekkers, Harold; Witters, Thomas; Jourdan, Nicolas; Van Ammel, Annemie; Vandersmissen, Kevin; Rodet, Simon; Philipsen, Harold; Radisic, Alex; Heylen, Nancy; Travaly, Youssef; Swinnen, Bart; Beyne, Eric (2011-06) -
The way towards front side metallization by copper-plating: what we can learn from microelectronics
Hernandez, Jose Luis; Aleman, Monica; Allebe, Christophe; Bearda, Twan; John, Joachim; Kuzma Filipek, Izabela; Philipsen, Harold; Posthuma, Niels; Prajapati, Victor; Rodet, Simon; Poortmans, Jef (2010) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Y.S.; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2011) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Yu-Shuen; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2010) -
Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Armini, Silvia; El-Mekki, Zaid; Vandersmissen, Kevin; Philipsen, Harold; Rodet, Simon; Honore, Mia; Radisic, Alex; Civale, Yann; Beyne, Eric; Leunissen, Peter (2011)