Publication:

Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

Date

2011-06
Proceedings Paper
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Author(s)

Redolfi, Augusto  
;
Velenis, Dimitrios  
;
Thangaraju, Sarasvathi
;
Nolmans, Philip  
;
Jaenen, Patrick  
;
Kostermans, Maarten
;
Baier, Ulrich
;
Van Besien, Els  
;
Dekkers, Harold  
;
Witters, Thomas  
;
Jourdan, Nicolas  
;
Van Ammel, Annemie  
;
Vandersmissen, Kevin  
;
Rodet, Simon
;
Philipsen, Harold  
;
Radisic, Alex  
;
Heylen, Nancy  
;
Travaly, Youssef
;
Swinnen, Bart  
;
Beyne, Eric  

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Abstract

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1972 since deposited on 2021-10-19
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