Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

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Authors
Redolfi, Augusto; Velenis, Dimitrios; Thangaraju, Sarasvathi; Nolmans, Philip; Jaenen, Patrick; Kostermans, Maarten; Baier, Ulrich; Van Besien, Els; Dekkers, Harold; Witters, Thomas; Jourdan, Nicolas; Van Ammel, Annemie; Vandersmissen, Kevin; Rodet, Simon; Philipsen, Harold; Radisic, Alex; Heylen, Nancy; Travaly, Youssef; Swinnen, Bart; Beyne, Eric
Conference
IEEE 61st Electronic Components and Technology Conference - ECTC
Title
Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Publication type
Proceedings paper
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