Browsing by author "Baelmans, M."
Now showing items 1-8 of 8
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Analytical thermo-mechanical model for non-underfilled area array flip chip assemblies
Vandevelde, Bart; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2004-09) -
Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Yang, Z.; Rivera, K.; Van der Plas, Geert; Pawlak, Bartek; England, L.; Beyne, Eric; Baelmans, M. (2020) -
Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages
Vandevelde, Bart; Gonzalez, Mario; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2004) -
Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages
Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric; Roose, E.; Corlatan, D.; Swaelen, G.; Willems, G.; Christiaens, F.; Vandepitte, D.; Baelmans, M. (2003) -
Parameter study for the reliability of underfilled flip chip and CSP assemblies
Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2002) -
Parameterised modelling of thermo-mechanical reliability for CSP assemblies
Vandevelde, Bart; Beyne, Eric; Zhang, K.G.Q.; Caers, J.; Vandepitte, D.; Baelmans, M. (2003) -
Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
Vandevelde, Bart; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2002) -
Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
Vandevelde, Bart; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2002)