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Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
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Authors
Vandevelde, Bart
;
Beyne, Eric
;
Vandepitte, D.
;
Baelmans, M.
Conference
Proceedings of the 3rd Eurosime Conference
Title
Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
Publication type
Proceedings paper
Embargo date
9999-12-31
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