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Conference contributions
Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
Publication:
Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
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Date
2002
Proceedings Paper
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6138.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Beyne, Eric
;
Vandepitte, D.
;
Baelmans, M.
Journal
Abstract
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1964
since deposited on 2021-10-14
Acq. date: 2025-12-10
Citations
Metrics
Views
1964
since deposited on 2021-10-14
Acq. date: 2025-12-10
Citations