Publication:

Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies

Date

2002
Proceedings Paper
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-3096-050X
cris.virtual.orcid0000-0002-6753-6438
cris.virtualsource.department67066e7b-3582-42ef-b040-694dc2e501ae
cris.virtualsource.department0aefe159-9129-4bab-908e-3a73693ee2e4
cris.virtualsource.orcid67066e7b-3582-42ef-b040-694dc2e501ae
cris.virtualsource.orcid0aefe159-9129-4bab-908e-3a73693ee2e4
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, D.
dc.contributor.authorBaelmans, M.
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T23:46:25Z
dc.date.available2021-10-14T23:46:25Z
dc.date.embargo9999-12-31
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6990
dc.source.beginpage86
dc.source.conferenceProceedings of the 3rd Eurosime Conference
dc.source.conferencedate14/04/2002
dc.source.conferencelocationParis France
dc.source.endpage91
dc.title

Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies

dc.typeProceedings paper
dspace.entity.typePublication
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