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Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages
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Authors
Vandevelde, Bart
;
Gonzalez, Mario
;
Beyne, Eric
;
Vandepitte, D.
;
Baelmans, M.
Conference
Proceedings European Microelectronics Packaging Symposium (IMAPS Europe)
Title
Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages
Publication type
Proceedings paper
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